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OPTORUN CO.,LTD.(6235) Summary

6235
TSE Prime
OPTORUN CO.,LTD.
3,870
JPY
+25
(+0.65%)
Apr 28, 3:30 pm JST
24.30
USD
Apr 28, 2:30 am EDT
Result
PTS
outside of trading hours
Summary Chart Historical News Financial Result
PER
27.6
PBR
2.70
Yield
1.45%
Margin Trading Ratio
5.23
Stock Price
Apr 28, 2026
Opening Apr 28, 9:00 am
3,830 JPY 24.03 USD
Previous Close Apr 27
3,845 JPY 24.12 USD
High Apr 28, 9:02 am
3,935 JPY 24.69 USD
Low Apr 28, 11:00 am
3,765 JPY 23.60 USD
Volume
532,600
Trading Value
2.05B JPY 0.01B USD
VWAP
3845.64 JPY 24.15 USD
Minimum Trading Value
387,000 JPY 2,430 USD
Market Cap
0.17T JPY 1.08B USD
Number of Trades
1,441
Liquidity & Number of Trades
As of Apr 28, 2026
Liquidity
Slightly High
1-Year Average
957
1-Year High Feb 17, 2026
8,228
Margin Trading
Date Short Interest Long Margin Positions Ratio
Apr 24, 2026 147,300 753,200 5.11
Apr 17, 2026 136,400 684,300 5.02
Apr 10, 2026 125,900 603,000 4.79
Apr 3, 2026 123,200 564,100 4.58
Mar 27, 2026 127,800 584,500 4.57
Company Profile
OPTORUN CO.,LTD. manufactures and sells optical thin film deposition equipment. The company focuses on automotive cameras and smartphones, with a strong advantage in comprehensive services including maintenance.
Sector
Machinery
OPTORUN CO.,LTD.'s main business is the manufacture and sale of optical thin film deposition equipment. The company provides optical thin film deposition systems used in touchscreens, casings, biometric sensors, camera modules, LED light sources, automotive cameras, and surveillance cameras for smartphones, tablets, and other devices. With a significant portion of production and sales in China, OPTORUN's customers include optical thin film deposition manufacturers and end-product manufacturers using optical thin films. Beyond equipment sales, OPTORUN distinguishes itself by offering deposition process advice and thin film deposition solutions that leverage its technical expertise, catering to diverse customer needs. The company handles various deposition methods, including ion beam-assisted deposition, reactive plasma deposition, sputtering, and atomic layer deposition.