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OPTORUN CO.,LTD.(6235) Summary

6235
TSE Prime
OPTORUN CO.,LTD.
1,826
JPY
-54
(-2.87%)
Dec 5, 3:30 pm JST
11.81
USD
Dec 5, 1:30 am EST
Result
PTS
outside of trading hours
1,832.8
Dec 5, 3:24 pm JST
Summary Chart Historical News Financial Result
PER
22.4
PBR
1.36
Yield
2.96%
Margin Trading Ratio
5.23
Stock Price
Dec 5, 2025
Opening Dec 5, 9:00 am
1,847 JPY 11.90 USD
Previous Close Dec 4
1,880 JPY 12.10 USD
High Dec 5, 9:01 am
1,858 JPY 11.97 USD
Low Dec 5, 3:30 pm
1,826 JPY 11.78 USD
Volume
98,400
Trading Value
0.18B JPY 1.17M USD
VWAP
1834.52 JPY 11.87 USD
Minimum Trading Value
182,600 JPY 1,181 USD
Market Cap
0.08T JPY 0.53B USD
Number of Trades
375
Liquidity & Number of Trades
As of Dec 5, 2025
Liquidity
Slightly High
1-Year Average
612
1-Year High Nov 12, 2025
3,433
Margin Trading
Date Short Interest Long Margin Positions Ratio
Nov 28, 2025 94,100 265,800 2.82
Nov 21, 2025 91,500 260,600 2.85
Nov 14, 2025 89,400 264,200 2.96
Nov 7, 2025 86,600 256,800 2.97
Oct 31, 2025 83,900 245,300 2.92
Company Profile
OPTORUN CO.,LTD. manufactures and sells optical thin film deposition equipment. The company focuses on automotive cameras and smartphones, with a strong advantage in comprehensive services including maintenance.
Sector
Machinery
OPTORUN CO.,LTD.'s main business is the manufacture and sale of optical thin film deposition equipment. The company provides optical thin film deposition systems used in touchscreens, casings, biometric sensors, camera modules, LED light sources, automotive cameras, and surveillance cameras for smartphones, tablets, and other devices. With a significant portion of production and sales in China, OPTORUN's customers include optical thin film deposition manufacturers and end-product manufacturers using optical thin films. Beyond equipment sales, OPTORUN distinguishes itself by offering deposition process advice and thin film deposition solutions that leverage its technical expertise, catering to diverse customer needs. The company handles various deposition methods, including ion beam-assisted deposition, reactive plasma deposition, sputtering, and atomic layer deposition.