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OPTORUN CO.,LTD.(6235) Summary

6235
TSE Prime
OPTORUN CO.,LTD.
2,850
JPY
-16
(-0.56%)
Mar 13, 3:30 pm JST
17.87
USD
Mar 13, 2:30 am EDT
Result
PTS
outside of trading hours
2,840
Mar 13, 11:44 pm JST
Summary Chart Historical News Financial Result
PER
20.2
PBR
1.98
Yield
1.96%
Margin Trading Ratio
5.23
Stock Price
Mar 13, 2026
Opening Mar 13, 9:03 am
2,794 JPY 17.56 USD
Previous Close Mar 12
2,866 JPY 18.02 USD
High Mar 13, 9:34 am
2,892 JPY 18.18 USD
Low Mar 13, 9:03 am
2,790 JPY 17.53 USD
Volume
299,200
Trading Value
0.85B JPY 5.33M USD
VWAP
2839.25 JPY 17.81 USD
Minimum Trading Value
285,000 JPY 1,787 USD
Market Cap
0.13T JPY 0.80B USD
Number of Trades
1,290
Liquidity & Number of Trades
As of Mar 13, 2026
Liquidity
Slightly High
1-Year Average
798
1-Year High Feb 17, 2026
8,228
Margin Trading
Date Short Interest Long Margin Positions Ratio
Mar 6, 2026 88,000 752,100 8.55
Feb 27, 2026 80,800 816,400 10.10
Feb 20, 2026 71,000 686,200 9.66
Feb 13, 2026 79,600 309,800 3.89
Feb 6, 2026 75,100 271,900 3.62
Company Profile
OPTORUN CO.,LTD. manufactures and sells optical thin film deposition equipment. The company focuses on automotive cameras and smartphones, with a strong advantage in comprehensive services including maintenance.
Sector
Machinery
OPTORUN CO.,LTD.'s main business is the manufacture and sale of optical thin film deposition equipment. The company provides optical thin film deposition systems used in touchscreens, casings, biometric sensors, camera modules, LED light sources, automotive cameras, and surveillance cameras for smartphones, tablets, and other devices. With a significant portion of production and sales in China, OPTORUN's customers include optical thin film deposition manufacturers and end-product manufacturers using optical thin films. Beyond equipment sales, OPTORUN distinguishes itself by offering deposition process advice and thin film deposition solutions that leverage its technical expertise, catering to diverse customer needs. The company handles various deposition methods, including ion beam-assisted deposition, reactive plasma deposition, sputtering, and atomic layer deposition.