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OPTORUN CO.,LTD.(6235) Summary

6235
TSE Prime
OPTORUN CO.,LTD.
2,019
JPY
-25
(-1.22%)
Jan 29, 3:30 pm JST
13.20
USD
Jan 29, 1:30 am EST
Result
PTS
outside of trading hours
Summary Chart Historical News Financial Result
PER
24.7
PBR
1.50
Yield
2.67%
Margin Trading Ratio
5.23
Stock Price
Jan 29, 2026
Opening Jan 29, 9:00 am
2,043 JPY 13.34 USD
Previous Close Jan 28
2,044 JPY 13.39 USD
High Jan 29, 9:00 am
2,053 JPY 13.40 USD
Low Jan 29, 11:21 am
2,000 JPY 13.05 USD
Volume
111,100
Trading Value
0.22B JPY 1.47M USD
VWAP
2019.55 JPY 13.2 USD
Minimum Trading Value
201,900 JPY 1,320 USD
Market Cap
0.09T JPY 0.59B USD
Number of Trades
541
Liquidity & Number of Trades
As of Jan 29, 2026
Liquidity
Slightly High
1-Year Average
607
1-Year High Nov 12, 2025
3,433
Margin Trading
Date Short Interest Long Margin Positions Ratio
Jan 23, 2026 80,200 263,900 3.29
Jan 16, 2026 70,000 240,300 3.43
Jan 9, 2026 65,500 241,400 3.69
Dec 26, 2025 94,500 254,600 2.69
Dec 19, 2025 79,200 268,600 3.39
Company Profile
OPTORUN CO.,LTD. manufactures and sells optical thin film deposition equipment. The company focuses on automotive cameras and smartphones, with a strong advantage in comprehensive services including maintenance.
Sector
Machinery
OPTORUN CO.,LTD.'s main business is the manufacture and sale of optical thin film deposition equipment. The company provides optical thin film deposition systems used in touchscreens, casings, biometric sensors, camera modules, LED light sources, automotive cameras, and surveillance cameras for smartphones, tablets, and other devices. With a significant portion of production and sales in China, OPTORUN's customers include optical thin film deposition manufacturers and end-product manufacturers using optical thin films. Beyond equipment sales, OPTORUN distinguishes itself by offering deposition process advice and thin film deposition solutions that leverage its technical expertise, catering to diverse customer needs. The company handles various deposition methods, including ion beam-assisted deposition, reactive plasma deposition, sputtering, and atomic layer deposition.