FUJIMI INCORPORATED(5384) Summary
5384
TSE Prime
FUJIMI INCORPORATED
Result
3,915
JPY
-90
(-2.25%)
Aug 7, 3:30 pm JST
24.73
USD
Aug 7, 2:30 am EDT
PER
27.9
PBR
3.41
Yield
1.97%
Margin Trading Ratio
7.50
PTS
outside of trading hours
3,988
Aug 7, 10:33 pm JST
Stock Price
Aug 7, 2026
Opening
Aug 7, 9:00 am
4,065
JPY
25.65
USD
Previous Close
Aug 6
4,005
JPY
25.37
USD
High
Aug 7, 9:00 am
4,065
JPY
25.65
USD
Low
Aug 7, 10:43 am
3,845
JPY
24.24
USD
Volume
414,000
Trading Value
1.63B
JPY
0.01B
USD
VWAP
3927.28
JPY
24.81
USD
Minimum Trading Value
391,500
JPY
2,473
USD
Market Capitalization
0.31T
JPY
1.98B
USD
Number of Trades
1,224
Opening
Aug 7, 10:33 pm
3,988
JPY
Previous Close
Aug 7
3,915
JPY
High
Aug 7, 10:33 pm
3,988
JPY
Low
Aug 7, 10:33 pm
3,988
JPY
Volume
300
Trading Value
1.19M
JPY
VWAP
3,988.00
JPY
Minimum Trading Value
ー
Market Capitalization
ー
Number of Trades
ー
PTS Stock Price
Liquidity & Number of Trades
As of Aug 7, 2026
Liquidity
Liquidity Grade
| Liquidity | Number Of Trades | Distribution |
|---|---|---|
| High | Over 1,000 | 13.9% |
| Slightly-High | 400 to 1,000 | 18.5% |
| Mid | 50 to 400 | 39.0% |
| Slightly-Low | 10 to 50 | 17.6% |
| Low | Less than 10 | 11.0% |
High
1-Year Average
1,127
1-Year High
Aug 6, 2026
2,898
Margin Trading
| Date | Short Interest | Long Margin Positions | Ratio |
|---|---|---|---|
| Jul 31, 2026 | 23,500 | 176,300 | 7.50 |
| Jul 24, 2026 | 20,500 | 173,800 | 8.48 |
| Jul 17, 2026 | 22,300 | 181,900 | 8.16 |
| Jul 10, 2026 | 18,000 | 132,900 | 7.38 |
| Jul 3, 2026 | 15,000 | 141,800 | 9.45 |
Company Profile
FUJIMI INCORPORATED is the world leader in polishing materials for semiconductor wafers. The company also has strengths in thermal spraying technology. CMP products are driving growth.
Sector
Glass & Ceramics Products
Website
FUJIMI INCORPORATED is a pioneer in precision synthetic abrasives manufacturing. The company produces and sells materials for mirror polishing of semiconductor substrates such as silicon wafers, CMP (Chemical Mechanical Planarization) products necessary for multilayer wiring of semiconductor chips, and polishing materials for computer hard disks. FUJIMI INCORPORATED operates globally, focusing on polishing materials for semiconductor wafers. With Japan as its base, the company has subsidiaries in North America, Malaysia, Taiwan, China, and Germany, establishing a worldwide production and sales network. FUJIMI INCORPORATED provides product supply and sales support tailored to the needs of each region.