DISCO CORPORATION(6146) Summary
6146
TSE Prime
DISCO CORPORATION
Result
ー
65,470
JPY
-360
(-0.55%)
Aug 14, 3:30 pm JST
411.06
USD
Aug 14, 2:30 am EDT
PER
ー
PBR
12.2
Yield
ー%
Margin Trading Ratio
8.78
PTS
outside of trading hours
65,200
Aug 14, 3:24 pm JST
Stock Price
Aug 14, 2026
Opening
Aug 14, 9:06 am
68,120
JPY
427.19
USD
Previous Close
Aug 13
65,830
JPY
413.01
USD
High
Aug 14, 9:06 am
68,120
JPY
427.19
USD
Low
Aug 14, 1:13 pm
64,730
JPY
406.21
USD
Volume
1,247,000
Trading Value
0.08T
JPY
0.52B
USD
VWAP
65937.48
JPY
413.99
USD
Minimum Trading Value
6,547,000
JPY
41,106
USD
Market Capitalization
7.10T
JPY
0.04T
USD
Number of Trades
7,385
Opening
Aug 13, 6:14 pm
66,000
JPY
Previous Close
Aug 13
65,993
JPY
High
Aug 14, 9:06 am
67,983
JPY
Low
Aug 14, 1:15 pm
64,720
JPY
Volume
378,500
Trading Value
24,926M
JPY
VWAP
65,857.11
JPY
Minimum Trading Value
ー
Market Capitalization
ー
Number of Trades
ー
PTS Stock Price
Liquidity & Number of Trades
As of Aug 14, 2026
Liquidity
Liquidity Grade
| Liquidity | Number Of Trades | Distribution |
|---|---|---|
| High | Over 1,000 | 13.9% |
| Slightly-High | 400 to 1,000 | 18.5% |
| Mid | 50 to 400 | 39.0% |
| Slightly-Low | 10 to 50 | 17.6% |
| Low | Less than 10 | 11.0% |
High
1-Year Average
13,504
1-Year High
Sep 19, 2025
38,680
Margin Trading
| Date | Short Interest | Long Margin Positions | Ratio |
|---|---|---|---|
| Aug 7, 2026 | 79,800 | 700,900 | 8.78 |
| Jul 31, 2026 | 87,200 | 698,700 | 8.01 |
| Jul 24, 2026 | 78,000 | 903,400 | 11.58 |
| Jul 17, 2026 | 66,900 | 618,300 | 9.24 |
| Jul 10, 2026 | 128,800 | 580,700 | 4.51 |
Company Profile
DISCO CORPORATION is the world leader in grinding, cutting, and polishing equipment for semiconductors and electronic components. The company also produces consumables such as grinding wheels.
Sector
Machinery
DISCO CORPORATION is a semiconductor manufacturing equipment maker that provides precision processing tools. The company is a global leader in grinding, cutting, and polishing equipment for semiconductors and electronic components. DISCO CORPORATION boasts high technological capabilities and market share in the precision processing field of semiconductor and electronic component manufacturing processes. The company offers precision processing equipment such as dicing saws, laser saws, grinders, polishers, and surface planers, as well as precision processing tools including dicing blades, grinding wheels, and dry polishing wheels. DISCO CORPORATION also handles maintenance and services related to these products and has established a global manufacturing, sales, and service system both domestically and internationally.