DISCO CORPORATION(6146) Summary
6146
TSE Prime
DISCO CORPORATION
Result
ー
79,900
JPY
+9,870
(+14.09%)
Jun 12, 3:30 pm JST
498.56
USD
Jun 12, 2:30 am EDT
PER
ー
PBR
14.8
Yield
ー%
Margin Trading Ratio
2.85
PTS
outside of trading hours
80,789
Jun 12, 11:58 pm JST
Stock Price
Jun 12, 2026
Opening
Jun 12, 9:06 am
73,750
JPY
460.41
USD
Previous Close
Jun 11
70,030
JPY
436.13
USD
High
Jun 12, 2:16 pm
80,100
JPY
499.78
USD
Low
Jun 12, 9:06 am
73,310
JPY
457.67
USD
Volume
3,648,100
Trading Value
0.29T
JPY
1.78B
USD
VWAP
78223.93
JPY
488.06
USD
Minimum Trading Value
7,990,000
JPY
49,856
USD
Market Capitalization
8.67T
JPY
0.05T
USD
Number of Trades
19,635
Opening
Jun 12, 5:21 pm
80,150
JPY
Previous Close
Jun 12
79,181
JPY
High
Jun 12, 8:25 pm
81,000
JPY
Low
Jun 12, 10:02 pm
78,900
JPY
Volume
4,500
Trading Value
360M
JPY
VWAP
80,172.11
JPY
Minimum Trading Value
ー
Market Capitalization
ー
Number of Trades
ー
PTS Stock Price
Liquidity & Number of Trades
As of Jun 12, 2026
Liquidity
Liquidity Grade
| Liquidity | Number Of Trades | Distribution |
|---|---|---|
| High | Over 1,000 | 13.9% |
| Slightly-High | 400 to 1,000 | 18.5% |
| Mid | 50 to 400 | 39.0% |
| Slightly-Low | 10 to 50 | 17.6% |
| Low | Less than 10 | 11.0% |
High
1-Year Average
15,216
1-Year High
Jul 18, 2025
46,521
Margin Trading
| Date | Short Interest | Long Margin Positions | Ratio |
|---|---|---|---|
| Jun 5, 2026 | 230,500 | 657,100 | 2.85 |
| May 29, 2026 | 190,000 | 903,100 | 4.75 |
| May 22, 2026 | 211,700 | 945,600 | 4.47 |
| May 15, 2026 | 224,200 | 963,000 | 4.30 |
| May 1, 2026 | 291,100 | 755,200 | 2.59 |
Company Profile
DISCO CORPORATION is the world leader in grinding, cutting, and polishing equipment for semiconductors and electronic components. The company also produces consumables such as grinding wheels.
Sector
Machinery
DISCO CORPORATION is a semiconductor manufacturing equipment maker that provides precision processing tools. The company is a global leader in grinding, cutting, and polishing equipment for semiconductors and electronic components. DISCO CORPORATION boasts high technological capabilities and market share in the precision processing field of semiconductor and electronic component manufacturing processes. The company offers precision processing equipment such as dicing saws, laser saws, grinders, polishers, and surface planers, as well as precision processing tools including dicing blades, grinding wheels, and dry polishing wheels. DISCO CORPORATION also handles maintenance and services related to these products and has established a global manufacturing, sales, and service system both domestically and internationally.