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US-JOINT Begins Full-Scale Development of Next-Generation Semiconductor Packages
Notice Regarding Disposal of Treasury Shares as Restricted Stock Compensation
Notice of Purchase of a Site for Plant in Koriyama City, Fukushima Prefecture
Notice Regarding Receipt of Dividend from Consolidated Subsidiary
IRRESISTIBLE MATERIALS AND TOKYO OHKA KOGYO CO., LTD. ANNOUNCE STRATEGIC INVESTMENT AND JOINT DEVELOPMENT PARTNERSHIP TO ADVANCE EUV LITHOGRAPHY
Notice Regarding Distribution of Surplus
TOKYO OHKA, 9% Increase in Ordinary Profit, Update Record High for Third Consecutive Term, Increased Previous Year's Dividend by 2 Yen, This Fiscal Year to Increase Dividend by 8 Yen
Notice Regarding Changes of Officers
Consolidated Financial Results for the Fiscal Year Ended December 31, 2025 [J-GAAP]
Notice Regarding Revision of TOK Group’s Medium-Term Plan “tok Medium-Term Plan 2027”
Presentation Materials for FY2025 Business Results
Notice on Revisions of Forecasts
TOKYO OHKA, Ordinary Profit Forecast for Last Fiscal Year Revised Upward by 20%, Raises Record High Profit Forecast
Presentation Materials for FY2025 3Q Business Results
Consolidated Financial Results for the Third Quarter of the Fiscal Year Ending December 31, 2025 [J-GAAP]
TOKYO OHKA, Jan-Sep (Cumulative 3Q) Ordinary Profit Increases by 36%, Jul-Sep Ordinary Profit Increases by 25%
Participating in "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging
(Correction) Notice of partial correction to business performance presentation material
Notice Regarding Construction of New Pyeongtaek Plant in Korean Subsidiary
Presentation Materials for FY2025 1H Business Results