Seiwa HD to acquire plating business from Mitaka Metal Industries to strengthen production capacity amid semiconductor demand growth
Seiwa Holdings <523A> announced after the close on June 3 that its subsidiary Fuji Plating Industries, a semiconductor component plating specialist, will acquire the metal surface treatment business of Mitaka Metal Industries on June 19. The transaction is projected to boost Fuji Plating's manufacturing capacity by around 35% through aggressive recruitment and capital expenditure. The move aims to strengthen its production base ahead of expanding semiconductor demand and widen its sales footprint in the Nagoya area. The purchase price was not disclosed.
Source: MINKABU PRESS
*Translated by generative AI. Click here for the original article.
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