NORITAKE gains on development of polishing pad for SiC wafers

Thu Sep 3, 2026 11:09 am JST Catalyst

Shares of NORITAKE CO., LIMITED <5331> traded firmly after the company announced on the 2nd that it had developed a diamond abrasive grain-embedded polishing pad for semiconductors, which was viewed positively by the market.

The newly developed diamond abrasive grain-embedded polishing pad, branded "LumiDia," is designed for use in the polishing process during the manufacturing of SiC (silicon carbide) wafers and other applications. The product features a proprietary structure that encapsulates diamond abrasive grains, achieving high polishing performance and enabling edge polishing of SiC wafers ? a process that had been difficult to achieve with diamond slurry. NORITAKE stated that the product contributes to the advancement of larger-diameter SiC wafers and also helps reduce industrial waste, as polishing can be performed using water alone.

Source: MINKABU PRESS

*Translated by generative AI. Click here for the original article.

NORITAKE gains on development of polishing pad for SiC wafers

Related Articles